L. Yobas
Hong Kong University of Science and Technology
Kowloon
Hong Kong

R.R. Baumann
Chemnitz University of Technology
Chemnitz
Germany

K. Bock
University of Dresden
Dresden
Germany

U. Demirci
Harvard Medical School
Cambridge, MA
USA

J. Jang
Kyung Hee University
Seoul
South Korea

A. Khademhosseini
Harvard Medical School
Cambridge, MA
USA

M. Madou
University of California
Irvine, CA
USA

N.-T. Nguyen
Griffith University
Queensland
Australia

P. Renaud
EPFL
Lausanne
Switzerland

S. Soper
Louisiana State University
Baton Rouge, LA
USA

H. Becker
microfluidic ChipShop GmbH
Jena
Germany

J. Castracane
University at Albany-SUNY
New York, NY
USA

S. Dimov
University of Birmingham
Birmingham
UK

S.A. Jenekhe
University of Washington
Seattle, WA
USA

D. Losic
University of Adelaide
Adelaide
Australia

C. Mao
University of Oklahoma
Oklahoma, OK
USA

S. Nie
Emory University-Georgia Institute of Technology
Georgia, GA
USA

J. Rogers
University of Illinois
Urbana, IL
USA

Y. Zhu
CSIRO Division of Materials Science and Engineering
Melbourne
Australia

F.F. Bier
Fraunhofer IBMT
Potsdam
Germany

Y. Chen
Ecole Normale Supérieure
Paris
France

Z.J. Fan
Harbin Engineering University
Harbin
China

P. Karioja
VTT Technical Research Centre
Oulu
Finland

W. Lu
The University of Michigan
Ann Arbor, MI
USA

J.S. Martí
University of Barcelona
Barcelona
Spain

N.M. Pugno
Università di Trento
Trento
Italy

A. Russom
KTH Royal Institute of Technology
Stockholm
Sweden